Characterization of Integrated Circuit Packaging Materials (Materials Characterization) [精裝]

內容簡介

With a particular emphasis on fabrication quality control, this volume in the "Materials Characterization" series focuses on characterization techniques used for critical junctures in package design like mold compound adhesion and strength, mechanical stress, moisture sensitivity, solderability of IC components, and interconnect systems. The readers will find: general overview of IC package reliability testing; characterization for the electrical performance of IC packages; understanding surface characteristics and interfaces for thermal management; and concise summaries of major characterization technologies for integrated circuit packaging materials, including acoustic microscopy, atomic absorption spectrometry, Auger Electron Spectroscopy, Energy-Dispersive X-Ray Spectroscopy, and many more.